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BGA Rework Station (P/N: T00328)
– With the liner slide, all the X, Y, X axis can do precision adjustment and fast
positioning
– HD touch screen, PLC control, can save multiple sets of temperature
profile data; with instant temperature curve analysis function
– 3 independent heating areas from top on to bottom. The 1st and 2nd are
hot air heaters, the 3rd is IR preheating, temperature controlled within +- 3
C –
Offer all kinds of hot air nozzles which can rotate 360; with magnet, easy to install and change
– Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled; it can
rework any BGA package size
– Powerful cross-flow fan rapidty cool the PCB to improve efficiency; Also built-in vacuum pump and external vacuum suction pen, pick
up the Chips rapidtyTotal Power: 4800W
Top Heater Power: 800W
Bottom Heater Power: 2nd heater: 1200W, 3rd IR heater: 2700W
Dimensions: 635 x 600 x 560mm
Positioning: V-groove, with external iniversal fixture
Temperature Control: K-type thermocouple (closed loop control)
PCB Size: Max: 410 x 370mm Min: 20 x 20mm
Net Weight: 40Kg -
ESD Soldering Station (P/N: T00220)
– Supperior heat recovery. Digital display
– Temperature locking system; sleep mode
– Temperature compensation; low temperature alarm
– Somposite tip of excellent thermal recovery and
accurate temperature setting.Power Consumpotin: 75W
Temperature Range: 200 – 450 C
Output Viltage: 24V
Applicalbe Tipe: T12 series
Dimenesions: 800(W) x 130(H) + 131(D)mm
Weight (w/o cord): 1.2 Kg -
BGA Rework Station (P/N: T00329)
– 3 independent Heating System
You can use software to choose to use top heater or bottom heater separatey or conbine the top and bottom heater’s capacity, so as to make it easier
to rework double BGA, CCGA, QFN, CSP, LGA, SMD, etc.
– Precise Optical Alignment System
Clear inmages with a 12st HD monitor, compoments can be enlarged up to
maximum 230 times, mounting accuracy within +- 0.001mm, with a beam
split, zoom in, zoom out and fine – tunning fincutions.
– Multi-funciton Openration System
With touch screen interface, k-type thermocouple and intelligent temperature compesation, intergrated design of top heater and sucker
point; it can auto identify a high degree of suction and mouting; with automatic soidering and desoidering functions; temperature can be
set to 6 segmets and 6 segment constant tempertature conrtol can save N groups of temperature setting parameters for different kinds of
BAG ship sets.
– Superior Safety Functions
Affter finish desoidering and soidering, there is alrming; when temperature goes out of control the circit will automatic power off, it is of
double excess temperature protection function. Apassword is needed for tempertature parameter to avoid random changesTotal Power: 4800W Max
Top Heater Power: 800W (1st heater)
Bottom Heater Power: 1200W (2nd heater)
3rd IR Heater: 2700W
Dimensions: 640 x 630 x 900mm
Temperature Control: K-type thermocouple (closed loop control)
Positioning: V-groove, with external iniversal fixture
PCB Size: Max: 410 x 370mm Min: 65 x 6mm
Available BGA Chip: 1 x 1mm – 80 x 80mm
External Temperature Sensor: 1piece
Net Weight: 40Kg -
ESD Soldering Station (P/N: T00221 )
– High frequecy curent heating element
– Fast heating and temperature recovery
– Auto – Idle prolongs the top life, energy-saving
– Password option for temperature lockingTemperature Range: 500 – 600 C
Output Viltage / Frequency: 36V AC / 400 KHz
Max Power: 90W
Applicalbe Tipe: 200 series
Dimenesions: 130(W) x 100(H) + 200(D)mm
Weight: 2.6 Kg